Best seller热销-12%
Semiconductor grade半导体级60,000 rpm, radial runout below 50 nm, air bearing, water-cooled.60,000 rpm，径向跳动小于 50 nm，气浮轴承，水冷。
An air-bearing spindle for dicing, wafer grinding and ultra-precision milling. The porous graphite journal and thrust bearings run without contact, so radial runout stays below 50 nm across the full speed range. A water-cooled housing and integrated thermal sensor keep thermal growth predictable in cleanroom operation.气浮主轴适用于划片、晶圆磨削与超精密铣削。多孔石墨径向与止推轴承无接触运行，全转速范围内径向跳动小于 50 nm。水冷外壳与内置温度传感器确保洁净室工况下的热伸长可控。
The interferometer report matched our own measurements to within 0.3 um on every axis.
We compared four suppliers for the wafer robot. Weizhun was the only one that sent a particle test report with the quotation.
Three assembly lines delivered on schedule, and their MES team integrated with ours in under a week.
Complete your order with these matching products.搭配采购，享受更优的整体价格。
